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• BOS (Beam Observation Systems)
• BOS-18-IW Technical Information

BOS-18-IW Beam Imaging Solutions (BIS) introduces the 90-degree BOS which allows remote imaging of a beam at 90 degrees to the imaging plane. The BOS-18-IW can be attached to a linear motion feedthrough and placed into and out of the beam allowing for remote imaging, deep within the vacuum chamber.

Technical Information

Imaging Area	18mm Diameter
MCP (Standard)	0.975″ Diam. (BOS-18-IW), 10 micron channel diameter, Imaging Grade, 18mm active area, 12 micron pitch, 5° Bias Angle, 40:1 Aspect Ratio (Standard, BOS-18-IW), Max. Gain: 2 x 104 (single plate, Std.) 1000V > 107 (chevron, OPT-01), 2000V
Phosphor Screen (Standard)	P-43 with aluminum overcoat. P-43 Peak Wavelength: λ= 545 nm.
Power Supply Requirements	0 – + 1000V, 1mA single MCP (Standard), 0 – + 2000V, 1mA dual MCP (OPT-01), 0 – + 5000V, 1 mA Phosphor Screen
Beam Energy Range	1 eV to over 50 keV
Beam Current Range	< 10 μA (with optional beam attenuation grids)
Vacuum	1 x 10-6 Torr or better required to operate MCP, UHV compatible, maximum bakeout temperature 300 C