Ion Beam Milling Systems

  • Ion Beam Milling Systems

NANO-MASTER’s Ion Beam Milling systems are very adaptable and can be built in various configurations depending on the application. A variety of sample holder and ion source configurations allow for a diverse range of applications. Sample holders used in the Ion Beam Milling systems have ±90° tilt, rotation, water cooling, and helium backside cooling. NANO-MASTER technology has demonstrated capability of keeping substrate temperatures below 50°C. By tilting and rotating trenches are beveled, and control over sidewall profile as well as radial uniformity is improved. Various options are available for different grid configurations and neutralizers. A sputtering option can be provided for coating freshly etched metal surfaces. Single wafer auto load and unload is also available.


  • Electropolished 14" SS cubical chamber
  • Water cooled ±90° automatically tiltable rotating substrate holder
  • MFC's
  • DC ion sources 1cm-16cm
  • ±1.2& etch uniformity across 6" substrate
  • Capable of cooling substrates to <50°C
  • 26" x 44" footprint with SS panels ideal for Class 100 cleanrooms
  • Fully automated PC based, recipe driven
  • LabVIEW user interface
  • EMO protection and safety interlocks
  • Spectroscopic end point detection
  • Helium backside cooling
  • Electropolished 21" SS cubical chamber
  • Auto load/unload
  • 1200 l/s turbomolecular pump
  • Cryogenic pumping package
  • Additional MFC's for reactive gases
  • Gridded RFICP sources
  • Hollow cathode or filament neutralization
  • Sputtering source for passivation layer deposition
  • III-V Photonics Components
  • Laser Gratings
  • High Aspect ratio etching of Photonics crystals
  • Deep Trenches on SiO2, Si and metals